Patent · US Active

2D multi-layer thickness measurement with reconstructed spectrum

US11684253B2 · kind B2 · utility

0Cited by

0References

12Claims

0Family size

Assignee

TOPCON CORPORATION · JP

Inventors

Zaixing Mao · Edgewater, US
Zhenguo Wang · Ridgewood, US
Bin Cao · Rochester, US
Kinpui Chan · Ridgewood, US

Key dates

Filing date	Apr 22, 2020
Grant date	Jun 27, 2023
Priority date	—
Expiry date	May 23, 2041

Classification

Technology area (CPC G)Physics
CPC primaryG01J3/45
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A method for determining thickness of layers of the tear film includes reconstructing a full- or hyper-spectral interference pattern from an imaged multi-spectral pattern. Tear film thickness can then be estimated from the full- or hyper-spectral interference pattern. Using a full- or hyper-spectral interference pattern provides a greater number of frequency sampling points for increased tear film thickness estimation accuracy, without traditional time consuming techniques.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.