Ultra-fine nanocrystalline diamond precision cutting tool and manufacturing method therefor
US11684981B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 18, 2018 |
| Grant date | Jun 27, 2023 |
| Priority date | — |
| Expiry date | Aug 10, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/30
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An ultra-fine nanocrystalline diamond precision cutting tool and a manufacturing method therefor. A diamond cutter is made of a thick self-supporting film of ultra-fine nanocrystalline diamond, the thick film having a thickness of 100-3000 microns, where 1 nanometer≤diamond grain size≤20 nanometers. In the manufacturing method, the growth of ultra-fine nanocrystalline diamond on a silicon substrate is accomplished by means of two steps of direct current hot cathode glow discharge chemical vapor deposition and hot filament chemical vapor deposition, then the silicon substrate is separated from the diamond to obtain a thick self-supporting film of ultra-fine nanocrystalline diamond, the thick self-supporting film of ultra-fine nanocrystalline diamond is laser cut and then welded to a cutter body, and then by means of edging, rough grinding and fine grinding, an ultra-fine nanocrystalline diamond precision cutting tool is obtained.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.