Method for laser machining inside materials
US11685003B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 7, 2018 |
| Grant date | Jun 27, 2023 |
| Priority date | — |
| Expiry date | Dec 1, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB28D5/0011
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The invention provides a method for laser modification of a sample to form a modified region at a target location within the sample. The method comprises positioning a sample in a laser system for modification by a laser; measuring tilt of a surface of the sample through which the laser focusses; using at least the measured tilt to determine a correction to be applied to an active optical element of the laser system; applying the correction to the active optical element to modify wavefront properties of the laser to counteract an effect of coma on laser focus; and laser modifying the sample at the target location using the laser with the corrected wavefront properties to produce the modified region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.