Heat removal system and method for an injection molding machine
US11685094B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 27, 2020 |
| Grant date | Jun 27, 2023 |
| Priority date | — |
| Expiry date | Jun 29, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG05B19/4099
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An injection molding heat removal sensing and control system and method are provided for determining and controlling a heat transfer rate for a mold in a molding machine. The system includes an inflow temperature sensor for sensing an inflow temperature for coolant provided to the mold, an outflow temperature sensor for sensing an outflow temperature for coolant exiting the mold, and a flow rate sensor for sensing a flow rate for coolant through the mold. The electronic processor is also configured to calculate a heat transfer rate for the mold from the inflow temperature, the outflow temperature, the flow rate for the coolant, and the calculated mass and the temperature of the molten plastic. The processor determines a time lag between when heat enters the mold and when heat is removed by the coolant and pre-emptively adjusts coolant flow rate to provide uniform heat transfer throughout a molding cycle. The heat transfer rate and total energy removed can be determined and provided on the display.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.