Method for manufacturing bonded object and bonded object manufacturing apparatus
US11685127B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 18, 2021 |
| Grant date | Jun 27, 2023 |
| Priority date | — |
| Expiry date | Feb 18, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2009/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A bonded object manufacturing apparatus is for manufacturing a bonded object in which a first object and a second object, which is more flexible than the first object, are bonded by a bonding agent, viscosity of which is variable, and includes: a bonding agent supplier that supplies the bonding agent to a first or second bonding surfaces; a thickening unit that increases the viscosity of the bonding agent; and a loading unit that applies a load to and deforms the second object against the bonding agent that closely adheres to the first bonding surface and becomes harder than the second object. In a method for manufacturing a bonded object, the first and second bonding surfaces are brought close to each other to hold the bonding agent therebetween, the bonding agent closely adheres to a required portion of the first bonding surface, and the second object is loaded and deformed against the bonding agent that closely adheres to the first bonding surface and is harder than the second object.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.