Micro-electromechanical system and method for producing same
US11685645B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 8, 2021 |
| Grant date | Jun 27, 2023 |
| Priority date | — |
| Expiry date | Apr 8, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/0145
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method of manufacturing a microelectromechanical system includes forming of an electromechanical element on a substrate. The method further includes preparation of an encapsulation package to form a sealed cavity integrating the electromechanical element, with the sealed cavity having a volume smaller than 10 mm3. The method includes physical vapor deposition of a getter film on the substrate or on a wall of the encapsulation package so that the getter film has a specific absorption surface area smaller than 8 m2/g, and sealing of the encapsulation package on the substrate by means of a thermal sealing cycle having a temperature enabling to activate said getter film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.