Capping plate for panel scale packaging of MEMS products
US11685649B2 · kind B2 · utility
0Cited by
3References
19Claims
0Family size
Assignee
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Key dates
| Filing date | Mar 20, 2019 |
| Grant date | Jun 27, 2023 |
| Priority date | — |
| Expiry date | Dec 23, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01J5/20
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method of manufacturing MEMS housings includes: providing glass spacers; providing a window plate; attaching the window plate to the glass spacers; aligning the glass spacers with a device glass plate having MEMS devices thereon; bonding the glass spacers to the device glass plate; and singulating the glass spacers, window plate, and device glass plate to produce the MEMS housings.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.