Resin composition, cured product, laminate, and electronic member
US11685807B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 30, 2019 |
| Grant date | Jun 27, 2023 |
| Priority date | — |
| Expiry date | Mar 12, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G2650/56
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention provides a resin composition containing an epoxy compound A having a specific structure having an aromatic ring, and having an epoxy equivalent in the range of from 500 to 10,000 g/eq, and an epoxy compound B having an epoxy equivalent in the range of from 100 to 300 g/eq, and a bonding agent containing the resin composition. Further, the present invention provides a cured product containing resin particles and a matrix resin, wherein the resin particles are a cured product of an epoxy compound A having a specific structure having an aromatic ring, and having an epoxy equivalent in the range of from 500 to 10,000 g/eq, and the matrix resin is a cured product of an epoxy compound B having an epoxy equivalent in the range of from 100 to 300 g/eq, and a laminate having a substrate and the cured product.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.