Aqueous electroless nickel plating bath and method of using the same
US11685999B2 · kind B2 · utility
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13References
14Claims
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Key dates
| Filing date | Jun 2, 2014 |
| Grant date | Jun 27, 2023 |
| Priority date | — |
| Expiry date | Aug 14, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/36
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electroless nickel plating solution and a method of using the same to produce a nickel deposit having a phosphorus content that remains at about 12% throughout the lifetime of the electroless nickel plating solution is disclosed. The electroless nickel plating solution comprises (a) a source of nickel ions; (b) a reducing agent comprising a hypophosphite; and (c) a chelation system comprising: (i) one or more dicarboxylic acids; and (ii) one or more alpha hydroxy carboxylic acids. The electroless nickel plating solution may also comprise stabilizers and brighteners.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.