Chip wiring layer temperature sensing circuit, temperature sensing method and chip thereof
US11686624B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 13, 2020 |
| Grant date | Jun 27, 2023 |
| Priority date | — |
| Expiry date | Aug 31, 2041 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01K7/14
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
This invention discloses a chip wiring layer temperature sensing circuit, a temperature sensing method, a chip stereo temperature sensor, and a chip thereof. The chip wiring layer temperature sensing circuit includes a metal wiring layer temperature detection module, a pulse delay detection module, and a temperature transition module; wherein the metal wiring layer temperature detection module is disposed at a metal interconnection structure of a metal wiring layer of a chip; and the metal interconnection structure is electrically connected to the pulse delay detection module; wherein the pulse delay detection module includes a system high-speed clock, a delay data generated after a pulse passing through the metal wiring layer temperature detection module detected by the system high-speed clock, and the delay data was sent to the temperature transition module; wherein the temperature transition module calculates a temperature of the metal wiring layer according to the delay data.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.