Optoelectronic computing platform

US11686955B2 · kind B2 · utility

Assignee

• Lightelligence, Inc. · US

Inventors

• Huaiyu Meng · Medford, US
• Cheng-Kuan Lu · Littleton, US
• Jonathan Terry · Cambridge, US
• Jingdong Deng · South Burlington, US
• Maurice B. Steinman · Marlborough, US
• Gilbert Hendry · Swampscott, US
• Yichen Shen · Hangzhou City, CN

Key dates

• Filing date: Jul 6, 2021
• Grant date: Jun 27, 2023
• Expiry date: Jul 6, 2041

Classification

• Technology area (CPC G): Physics
• CPC primary: G02F1/225
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

An integrated circuit interposer includes a semiconductor substrate layer; a first metal contact layer including a first metal contact section that includes metal contacts arranged for electrically coupling to a first semiconductor die in a controlled collapsed chip connection, and a second metal contact section that includes metal contacts arranged for electrically coupling to a second semiconductor die in a controlled collapsed chip connection. A first patterned layer includes individually photomask patterned metal path sections. A second patterned layer includes individually photomask patterned waveguide sections, including a first waveguide that crosses at least one boundary between individually photomask patterned waveguide sections. A first modulator is coupled to the first waveguide for modulating an optical wave in the first waveguide based on an electrical signal received at a first metal contact in the first metal contact section, and a second modulator is coupled to the first waveguide for modulating the optical wave based on an electrical signal received at a second metal contact in the first metal contact section or the second metal contact section.