Binder resin, positive-type photosensitive resin composition, insulating film and semiconductor device
US11687002B2 · kind B2 · utility
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1References
10Claims
0Family size
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Key dates
| Filing date | Jul 30, 2021 |
| Grant date | Jun 27, 2023 |
| Priority date | — |
| Expiry date | Jan 4, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2203/20
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present specification relates to a binder resin, a photosensitive resin composition, an insulating film and a semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.