Interface for semiconductor device and interfacing method thereof
US11687472B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Aug 20, 2020 |
| Grant date | Jun 27, 2023 |
| Priority date | — |
| Expiry date | Nov 3, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03L7/081
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An interface for a semiconductor device is provided. The semiconductor device has a master device and multiple slave devices as stacked up with electric connection. The interface includes a master interface, implemented in the master device and including a master interface circuit with a master bond pattern. Further, a slave interface is implemented in each slave device and includes a slave interface circuit with a slave bond pattern to correspondingly connect to the master bond pattern. A clock route is to transmit a clock signal through the master interface and the slave interface. The master device transmits a command and a selecting slave identification through the master interface to all the slave interfaces. One of the slave devices corresponding to the selecting slave identification executes the command and responds a result back to the master device through the slave interfaces and the master interface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.