Modular fingerprint recognition package having reduced size
US11688750B2 · kind B2 · utility
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1References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 24, 2018 |
| Grant date | Jun 27, 2023 |
| Priority date | — |
| Expiry date | Jul 1, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48091
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A fingerprint recognition package may include a circuit board; an image sensor die attached and electrically connected to the circuit board; a light-shielding member applied to the circuit board; and an adhesive member attached to one side of the light-shielding member. The light-shielding member can be cured by being irradiated with ultraviolet rays, and can be thermoset by being irradiated with heat.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.