Electronic device and manufacturing method therefor
US11689177B2 · kind B2 · utility
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11Claims
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Assignee
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Key dates
| Filing date | Aug 19, 2021 |
| Grant date | Jun 27, 2023 |
| Priority date | — |
| Expiry date | Sep 30, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H2003/0457
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
An electronic device that includes a base substrate having a mounting surface; an electronic component having a mechanical vibration portion mounted on the mounting surface of the base substrate; an intermediate layer mounted on the base substrate and forming an internal space with the base substrate so as to accommodate the electronic component therein, the intermediate layer having at least one through-hole that opens the internal space to an outside; and a sealing layer on the intermediate layer and sealing the internal space by closing the at least one through-hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.