Thermal management for thermal cyclers using air tubes
US11690169B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 16, 2022 |
| Grant date | Jun 27, 2023 |
| Priority date | — |
| Expiry date | Jun 16, 2042 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02B30/70
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A thermal management system that include an electronic circuit boards having at least two circuit boards with a space in between and further includes one or more air tubes or conduits. The electronic circuit board and air tubes are configured for drawing air into the space to facilitate cooling of the electronic circuit board concurrent with cooling of a heat sink of a heat pump connected with the electronic circuit board. The system can further include a partition to isolate airflow from the heat sink from airflow through the electronics circuit board, and can further include one or more interface components for maintaining isolation and control of air flow, improving air intake and/or supporting auxiliary components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.