Apparatus for materials processing
US11691216B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 18, 2019 |
| Grant date | Jul 4, 2023 |
| Priority date | — |
| Expiry date | Feb 19, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/54
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method includes depositing a plurality of dopant particles within a predetermined region of a transparent material. The method also includes focusing a laser beam along an optical axis to a focal region that overlaps with at least a portion of the predetermined region. The focal region can irradiate at least a first dopant particle of the plurality of dopant particles. The method further includes adjusting a parameter of the laser beam to generate a plasma configured to form an inclusion within the transparent material. The method additionally includes scanning the focal region along a path within the transparent material to elongate the inclusion generally along the path.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.