Friction polishing device for polymer filament
US11691240B1 · kind B1 · utility
0Cited by
2References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 18, 2019 |
| Grant date | Jul 4, 2023 |
| Priority date | — |
| Expiry date | Mar 29, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D13/145
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing device for polishing bristles includes a grinding surface and a friction material thereon, the friction material having aramid fibers or pulp bonded with a polyimide resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.