Polymer sealed in-mold decoration and method of manufacture
US11691321B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 9, 2020 |
| Grant date | Jul 4, 2023 |
| Priority date | — |
| Expiry date | Aug 14, 2041 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31678
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An injection molded product formed from an inner layer, or substrate, to which an aesthetic IMD layer is bonded during a first injection molding process, leaving a portion of the substrate exposed about the perimeter(s) of the substrate. A transparent outer layer, or overmold, is then injection molded over the top of the IMD layer and substrate, bonding substantially to the IMD layer and to the substrate where it remains exposed following the first injection molding. The process of forming a product through the disclosed two-step injection molding process creates a customizable, aesthetic product with an aesthetic IMD layer completely encapsulated between the substrate and a clear overmold in such a way to protect the IMD layer from the environment in which the product is used.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.