Injection molding device, injection molding method, and injection molding resin material
US11691324B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 30, 2018 |
| Grant date | Jul 4, 2023 |
| Priority date | — |
| Expiry date | Feb 3, 2039 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2995/0006
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An injection molding device includes an injection machine, a molding die, and a high frequency oscillation device. The injection machine injects a resin material containing a dielectric heat generating material while keeping fluidity by temperature control. The molding die includes a cavity being a channel of flow of the resin material, and a pair of electrodes, each of which faces the cavity, the pair of electrodes being disposed to sandwich the resin material therebetween in a direction crossing a direction of the flow. The high frequency oscillation device applies a high frequency alternate-current voltage to the pair of electrodes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.