Thermoforming device and thermoforming method
US11691329B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 23, 2021 |
| Grant date | Jul 4, 2023 |
| Priority date | — |
| Expiry date | Nov 23, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C51/427
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A thermoforming device according to the present invention has a masking plate and a heater block. A plurality of the heater blocks are disposed with a space therebetween in a planar direction of the masking plate. The thickness of the masking plate is 0.2-3.0 mm. The distance of the space is 1-15 mm, and the distance of the space is set at least five times larger than the thickness of the masking plate. Heat to be transmitted to the masking plate from a high temperature heater block is more easily transmitted in the thickness direction of the masking plate than in the surface direction of the masking plate, and is more easily transmitted to the sheet than to a portion, of the masking plate, corresponding to a low temperature heater block, whereby a temperature difference is provided between different zones of the masking plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.