High frequency adhesive bonding
US11691351B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 29, 2019 |
| Grant date | Jul 4, 2023 |
| Priority date | — |
| Expiry date | Aug 23, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2301/416
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A system and method for bonding a first layer of material to a second layer of material includes a first electrically conductive plate, a second electrically conductive plate spaced apart from the first electrically conductive plate. The second electrically conductive plate is electrically grounded. A high frequency generator in electrical communication with the first electrically conductive plate supplies high frequency electrical signals to the first electrically conductive plate. An adhesive applied to one of the first and second layers of material has an electromagnetic susceptor material that when subjected to the electric field heats the adhesive to an adhesive curing temperature to bond the first layer of material to the second layer of material. A clamping mechanism applies pressure to one of the first and second layers of material to maintain contact between the first and second layers until an adhesive cure time has lapsed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.