Method and device for in situ marking a workpiece in a thermal forming process
US11691362B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 21, 2021 |
| Grant date | Jul 4, 2023 |
| Priority date | — |
| Expiry date | Sep 21, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2037/80
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method for marking a workpiece (6) uses a device, wherein the workpiece (6) is formed at least partially in a thermal master or forming process, comprises a surface (10) directed towards the workpiece (6), wherein a number of individually controllable heating elements (2) is distributed behind the surface (10) for a local heating of a workpiece surface portion. Each of the heating elements (2) comprises a solid material (11) having a surface structure and a heating structure (3), wherein the surface (10) directed towards the workpiece (6) encompassing the surface structures (40) has a uniform smooth surface allowing to dark, burn or foam the surface (7) of the workpiece (6) through heat introduction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.