Filament compositions for fused filament fabrication and methods of use thereof
US11692063B2 · kind B2 · utility
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1References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 12, 2017 |
| Grant date | Jul 4, 2023 |
| Priority date | — |
| Expiry date | Nov 28, 2039 |
Classification
- Technology area (CPC D)Textiles; Paper
- CPC primaryD01F6/905
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The disclosure generally relates to filaments and in particular, filaments for use in fused filament fabrication to prepare 3D printed articles. The filaments may be prepared from a polymer composition comprising: A) 55 to 95 weight percent semi-aromatic copolyamide having a melting point; and B) 5 to 45 weight percent amorphous copolyamide having a melting point.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.