Monolithic integrated quantum dot photonic integrated circuits
US11693178B2 · kind B2 · utility
0Cited by
6References
17Claims
0Family size
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Key dates
| Filing date | Aug 8, 2022 |
| Grant date | Jul 4, 2023 |
| Priority date | — |
| Expiry date | Aug 8, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S2301/173
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A photonic integrated circuit (PIC) includes a semiconductor substrate, one or more passive components, and one or more active components. The one or more passive components are fabricated on the semiconductor substrate, wherein the passive components are fabricated in a III-V type semiconductor layer. The one or more active components are fabricated on top of the one or more passive components, wherein optical signals are communicated between the one or more active components via the one or more passive components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.