Methods for printing solder paste and other viscous materials at high resolution
US11697166B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 8, 2022 |
| Grant date | Jul 11, 2023 |
| Priority date | — |
| Expiry date | Aug 8, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/163
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Systems and methods in which dot-like portions of a material (e.g., a viscous material such as a solder paste) are printed or otherwise transferred onto an intermediate substrate at a first printing unit, the intermediate substrate having the dot-like portions of material printed thereon is transferred to a second printing unit, and the dot-like portions of material are transferred from the intermediate substrate to a final substrate at the second printing unit. Optionally, the first printing unit includes a coating system that creates a uniform layer of the material on a donor substrate, and the material is transferred in the individual dot-like portions from the donor substrate onto the intermediate substrate at the first printing unit. Each of the first and second printing units may employ a variety of printing or other transfer technologies. The system may also include material curing and imaging units to aid in the overall process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.