Patent · US Active

Methods and apparatuses for laser processing materials

US11697178B2 · kind B2 · utility

0Cited by

238References

4Claims

0Family size

Assignee

CORNING INCORPORATED · US

Inventors

Richard Grundmueller · Lengenwang, DE
Frank Fabian Herrnberger · Munich, DE
Michael Klein · Bielefeld, DE
Florian Spaeth · Unterschleißheim, DE

Key dates

Filing date	Oct 6, 2017
Grant date	Jul 11, 2023
Priority date	—
Expiry date	Oct 6, 2037

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB23K2103/56
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

Methods of laser processing a transparent material are disclosed. The method may include positioning the transparent material on a carrier and transmitting a laser beam through the transparent material, where the laser beam may be incident on a side of the transparent material opposite the carrier. The transparent material may be substantially transparent to the laser beam and the carrier may include a support base and a laser disruption element. The laser disruption element may disrupt the laser beam transmitted through the transparent material such that the laser beam may not have sufficient intensity below the laser disruption element to damage the support base.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.