Patent · US Active

Method and tool for molding an electronic module, and molded electronic module

US11697230B2 · kind B2 · utility

0Cited by

1References

7Claims

0Family size

Assignee

ZF FRIEDRICHSHAFEN AG · DE

Inventors

Marco Knier · Pegnitz, DE
Thomas Deichler · Sulzbach-Rosenberg, DE
Christoph Schikora · Regensburg, DE

Key dates

Filing date	Jan 23, 2020
Grant date	Jul 11, 2023
Priority date	—
Expiry date	May 22, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/1316
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A method may include coating an electronic module in a tool, where the electronic module has a first sub-module and a second sub-module, where the tool has a first tool part and a second tool part, where the tool has a cavity at least partially formed between the first tool part and the second tool part, and where the first sub-module and the second sub-module are supported on the tool and held in the cavity at a spatially defined distance relative to one another in a contactless manner during the coating process. A tool for performing such method may include a first tool part and a second tool part that form a cavity, where the first tool part has a first molding surface section and at least one first supporting section that extends over the first molding surface section and the second tool part has a second molding surface section and at least one second supporting section that extends over the second molding surface section.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.