Patent · US Active

Load introduction device and method for adhesive bonding of a load introduction device

US11697249B2 · kind B2 · utility

0Cited by
0References
17Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 13, 2019
Grant dateJul 11, 2023
Priority date
Expiry dateJun 12, 2040

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB29L2031/3002
  • WIPO fieldOther special machines
  • WIPO sectorMechanical engineering

Abstract

A load introduction device and a method for adhesive bonding of a load introduction device for fiber composite materials is disclosed. A sealant, particularly a first adhesive is used in the creation of a cavity and in the creation of a secured arrangement for the injection of adhesive into the cavity.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.