Load introduction device and method for adhesive bonding of a load introduction device
US11697249B2 · kind B2 · utility
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17Claims
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Assignee
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Key dates
| Filing date | Feb 13, 2019 |
| Grant date | Jul 11, 2023 |
| Priority date | — |
| Expiry date | Jun 12, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/3002
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A load introduction device and a method for adhesive bonding of a load introduction device for fiber composite materials is disclosed. A sealant, particularly a first adhesive is used in the creation of a cavity and in the creation of a secured arrangement for the injection of adhesive into the cavity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.