Bone-conduction sensor assembly
US11697587B2 · kind B2 · utility
0Cited by
3References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 3, 2021 |
| Grant date | Jul 11, 2023 |
| Priority date | — |
| Expiry date | Feb 14, 2042 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B2201/0285
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides a bone-conduction sensor assembly. The bone-conduction sensor assembly includes a housing, a printed circuit board assembly forming a first receiving cavity together with the housing, a diaphragm accommodated in the first receiving cavity, a MEMS die and an ASIC chip mounted on the printed circuit board assembly. The MEMS die electrically connects to the ASIC chip through a bonding wire. A first weight is located on a surface of the diaphragm facing to the printed circuit board assembly. A position of the first weight has an avoiding portion corresponding to the bonding wire.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.