Slotted MEMS force sensor
US11698310B2 · kind B2 · utility
1Cited by
158References
16Claims
0Family size
Assignee
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Key dates
| Filing date | Mar 29, 2021 |
| Grant date | Jul 11, 2023 |
| Priority date | — |
| Expiry date | Aug 31, 2041 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B2203/04
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Described herein is a MEMS force sensor with stress concentration design. The stress concentration can be performed by providing slots, whether through or blind, and/or selective thinning of the substrate. The MEMS force sensor is in chip scale package with solder bumps or metal pillars and there are sensing elements formed on the sensor substrate at the stress concentrate area. The stress concentration can be realized through slots, selective thinning and a combination of both.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.