Semiconductor device in 3D stack with communication interface and managing method thereof
US11699683B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Sep 30, 2020 |
| Grant date | Jul 11, 2023 |
| Priority date | — |
| Expiry date | Nov 3, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/06541
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor device with an interface includes a master device and a plurality of slave devices. The master device includes a master interface. The slave devices are stacked on the master device one after one as a three-dimension (3D) stack. Each of the slave devices includes a slave interface and a managing circuit, the master interface and the slave interfaces form the interface for passing signals in communication between the master device and the slave devices. The managing circuit of a current one of the slave devices drives a next one of the slave devices. An operation command received at the current one of the slave devices is just passed to the next one of the slave devices through the interface. A response from the current one of the slave devices is passed back to the master device through the interface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.