Patent · US Active

Non-cure and cure hybrid film-on-die for embedded controller die

US11699685B2 · kind B2 · utility

0Cited by

1References

20Claims

0Family size

Assignee

Western Digital Technologies, Inc. · US

Inventors

Ling Yang · Ebao, CN
Hui Xu · Lo Wu, CN
Chong Un Tan · Kuala Pilah, MY

Key dates

Filing date	Jul 14, 2021
Grant date	Jul 11, 2023
Priority date	—
Expiry date	Dec 29, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor assembly includes a first die and a second die. The semiconductor assembly also includes a film on die (FOD) layer configured to attach the first die to the second die. The FOD layer is disposed on a first surface of the first die. The FOD layer includes a first portion comprising a first die attach film (DAF) disposed on an inner region of the first surface. The FOD layer also includes a second portion that includes a second DAF disposed on a peripheral region of the first surface surrounding the inner region. The second DAF includes a different material than the first DAF.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.