Headphones with an anti-buckling assembly
US11700471B2 · kind B2 · utility
3Cited by
44References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 26, 2022 |
| Grant date | Jul 11, 2023 |
| Priority date | — |
| Expiry date | May 26, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG10K11/17873
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.