Method for manufacturing a circuit board
US11700698B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Mar 4, 2022 |
| Grant date | Jul 11, 2023 |
| Priority date | — |
| Expiry date | Mar 4, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0715
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a circuit board comprises: a first single-sided board and an insulating structure are provided. The first single-sided board is pressed to the insulating structure and covers opposite side surfaces of the insulating structure to form a first laminated board. A second single-sided board and a third single-sided board are provided. The second single-sided board is pressed to the third single-sided board and covers opposite side walls of the third single-sided board to form a second laminated board. An inner wiring layer is formed by the second laminated board. The second laminated board with the inner wiring layer and the first laminated board are pressed to form an intermediate structure. Outer wiring layers are formed by the intermediate structure. Covering films are formed on surfaces of the outer wiring layers. Electromagnetic interference shielding layers are formed on the covering films.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.