Electronic assemblies including a conformal moisture barrier
US11700993B2 · kind B2 · utility
1Cited by
0References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 4, 2020 |
| Grant date | Jul 18, 2023 |
| Priority date | — |
| Expiry date | Sep 15, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1322
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
An electronic assembly includes a printed circuit board (“PCB”), an electrical component attached to a surface of the PCB, and a conformal barrier disposed on at least a portion of the surface of the PCB and on an outer surface of the electrical component. The conformal barrier includes a first barrier layer including an atomic layer deposited film and a second barrier layer including Parylene.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.