Resin component, and molding method and molding device for same
US11701806B2 · kind B2 · utility
0Cited by
3References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 20, 2017 |
| Grant date | Jul 18, 2023 |
| Priority date | — |
| Expiry date | Nov 11, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/3038
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An instrument panel (10) includes a base material portion (20) made of a base material M1 and a different material portion (30) made of a different material M2 having a different thermal shrinkage from that of the base material M1, and in the instrument panel (10), the base material portion (20) and the different material portion (30) are connected in a state such that at least a part of the two materials do not overlap.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.