Additive manufacturing, spatial heat treating system and method
US11701819B2 · kind B2 · utility
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14Claims
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Key dates
| Filing date | Jan 30, 2017 |
| Grant date | Jul 18, 2023 |
| Priority date | — |
| Expiry date | Mar 8, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
An additive manufacturing system including a two-dimensional energy patterning system for imaging a powder bed is disclosed. The two-dimensional energy patterning system may be used to control the rate of cooling experienced by each successive additive layer. Accordingly, the system may be used to heat treat the various additive layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.