Curable silicone composition and cured product thereof
US11702510B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 9, 2019 |
| Grant date | Jul 18, 2023 |
| Priority date | — |
| Expiry date | Jun 28, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G77/70
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A curable silicone composition is disclosed herein. The curable silicone composition comprises: (A) an alkenyl group-containing organopolysiloxane comprising (A1) a linear organopolysiloxane having at least two alkenyl groups per molecule, and (A2) a resinous organopolysiloxane; (B) a silicon atom-bonded hydrogen atom-containing organopolysiloxane comprising (B1) a resinous organopolysiloxane, (B2) a linear or partially branched organopolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule, and having not less than 0.5 mass % of silicon atom-bonded hydrogen atoms, and (B3) a linear organopolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule, and having less than 0.5 mass % of silicon atom-bonded hydrogen atoms; and (C) a hydrosilylation reaction catalyst. The curable silicone composition can be cured to form a cured product generally exhibiting good elongation and tensile strength.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.