Compound for release agent and method for preparing the same
US11702554B2 · kind B2 · utility
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1References
5Claims
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Assignee
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Key dates
| Filing date | Aug 26, 2020 |
| Grant date | Jul 18, 2023 |
| Priority date | — |
| Expiry date | Nov 1, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05D2503/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention relates to a compound for release agent and method for preparing the same, and more specifically, to a compound for a release agent that can be coated in an ultra-thin form without thermal deformation even when heat is continuously or discontinuously applied in a continuous evaporator, and a method for preparing the same.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.