Sensor module
US11703491B2 · kind B2 · utility
1Cited by
0References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 28, 2021 |
| Grant date | Jul 18, 2023 |
| Priority date | — |
| Expiry date | Jun 28, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K5/0026
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Disclosed herein is a sensor module that includes a substrate having a top surface and a back surface, a sensor element mounted on the top surface of the substrate, an external terminal formed on the back surface of the substrate, and a case fixed to the substrate so as to cover the sensor element. The case has a top plate part having a plurality of through holes. The top plate part has a center area having no through holes and a through hole formation area having the plurality of through holes, the through hole formation area being positioned so as to surround the center area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.