Scalable system-in-package architectures

US11704271B2 · kind B2 · utility

Assignee

• Alibaba Group Holding Limited · KY

Inventors

• Lide Duan · Sunnyvale, US
• Wei Han · Xi'an, CN
• Yuhao Wang · Hangzhou City, CN
• Fei Xue · Sunnyvale, US
• Yuanwei Fang · San Mateo, US
• Hongzhong Zheng · Los Gatos, US

Key dates

• Filing date: Aug 20, 2020
• Grant date: Jul 18, 2023
• Expiry date: Sep 16, 2040

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02D10/00
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A system-in-package architecture in accordance with aspects includes a logic die and one or more memory dice coupled together in a three-dimensional slack. The logic die can include one or more global building blocks and a plurality of local building blocks. The number of local building blocks can be scalable. The local building blocks can include a plurality of engines and memory controllers. The memory controllers can be configured to directly couple one or more of the engines to the one or more memory dice. The number and type of local building blocks, and the number and types of engines and memory controllers can be scalable.