Hard disk drive suspension pad pre-solder formation and guiding
US11705153B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 23, 2022 |
| Grant date | Jul 18, 2023 |
| Priority date | — |
| Expiry date | Mar 23, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/107
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A hard disk drive flexure assembly includes a metal substrate having a gap between a root side and a slider side, a base layer and a first conductive layer that each bridges the gap, and a plurality of electrical pads where the pads extend to the slider side of the flexure so as to positionally overlap with a slider end edge and corresponding slider electrical pads. Pre-solder bumps are formed on each pad. This configuration facilitates formation of a functional solder bridge between the flexure and the slider because the melted solder can readily spread on the extended flexure pad surface and reach the slider pad when the pre-solder bump is heated, as the pad material has higher solder wettability than that of a cover layer material. These techniques are especially relevant with narrow, high-density, small pitch electrical pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.