Antenna module grounding for phased array antennas
US11705627B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 26, 2021 |
| Grant date | Jul 18, 2023 |
| Priority date | — |
| Expiry date | Jul 6, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q3/30
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
Technologies directed to a radio frequency (RF) structure that provides an electrically insulating gap between a ground plane of a circuit board and a chassis at direct current (DC) and an electrical connection between the ground plane and the chassis at RF frequencies. One RF structure includes a first conductor electrically coupled to the ground plane and a second conductor electrically coupled to the chassis. A physical arrangement of a portion of the first conductor and a portion of the second conductor causes the RF structure to provide an electrically insulating gap between the ground plane and the chassis at DC and an electrical connection between the ground plane and the chassis at RF frequencies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.