Process for producing a micro-electro-mechanical system from a transferred piezoelectric or ferroelectric layer

US11705880B2 · kind B2 · utility

Assignees

• COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES · FR
• UNIVERSITE DE FRANCHE-COMTE · FR
• ECOLE NATIONALE SUPERIEURE DE MECANIQUE ET DES MICROTECHNIQUES (ENSMM) · FR

Inventors

• Alexandre Reinhardt · Saint-Martin-d'Hères, FR
• Marie Bousquet · Grenoble, FR
• Ausrine BARTASYTE · Vélieux, FR

Key dates

• Filing date: Feb 25, 2020
• Grant date: Jul 18, 2023
• Expiry date: Aug 6, 2041

Classification

• Technology area (CPC H): Electricity
• CPC primary: H03H2003/025
• WIPO field: Basic communication processes
• WIPO sector: Electrical engineering

Abstract

A process for fabricating a micro-electro-mechanical system, includes the following steps: production of a stack on the surface of a temporary substrate so as to produce a first assembly, comprising: at least depositing a piezoelectric material or a ferroelectric material to produce a layer of piezoelectric material or of ferroelectric material; producing a first bonding layer; production of a second assembly comprising at least producing a second bonding layer on the surface of a host substrate; production of at least one acoustic isolation structure in at least one of the two assemblies; production of at least one electrode level containing one or more electrodes in at least one of the two assemblies; bonding the two assemblies via the two bonding layers, before or after the production of the at least one electrode level in at least one of the two assemblies; removing the temporary substrate.