Power semiconductor module and method for arranging said power semiconductor module

US11706883B2 · kind B2 · utility

Assignee

• SEMIKRON ELEKTRONIK GMBH & CO. KG · DE

Inventors

• Sandro Bulovic · Fürth, DE
• Harald Kobolla · Seukendorf, DE

Key dates

• Filing date: Mar 18, 2020
• Grant date: Jul 18, 2023
• Expiry date: Jun 7, 2040

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2224/4823
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A power semiconductor module contains a power semiconductor assembly, a housing which in a housing side with an outer surface has a recess with a direction of passage in the normal direction of the outer surface, having an internal contact device which has an electrically conducting contact inside the housing to an external connection element, designed as a load terminal element, with one section in the recess and having a spring element. The connection element is designed as a rigid metallic shaped body with an inner and an outer contact surface, and the outer contact surface is accessible from the outside, and the connection element is connected to the housing via an electrically insulating and mechanically elastic retaining device such that the connection element is moveable in the direction of passage, and wherein the spring element is arranged and designed in such a way that the spring action thereof acts directly or indirectly on the connection element in the direction of passage.