Di capacitive embedded metal card
US11710024B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 7, 2022 |
| Grant date | Jul 25, 2023 |
| Priority date | — |
| Expiry date | Apr 7, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06K19/07794
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A transaction card having a metal layer, an opening in the metal layer for a transponder chip, and at least one discontinuity extending from an origin on the card periphery to a terminus in the opening. The card has a greater flex resistance than a card having a comparative discontinuity with the terminus and the origin the same distance from a line defined by a first long side of the card periphery in an absence of one or more strengthening features. Strengthening features include a discontinuity wherein one of the terminus or the origin are located relatively closer to the first long side of the card periphery than the other, a plurality of discontinuities wherein fewer than all extend from the card periphery to the opening, a self-supporting, non-metal layer disposed on at least one surface of the card, or one or more ceramic reinforcing tabs surrounding the opening.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.