Electronics assemblies and methods of manufacturing electronics assemblies with improved thermal performance
US11710676B2 · kind B2 · utility
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3References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 20, 2021 |
| Grant date | Jul 25, 2023 |
| Priority date | — |
| Expiry date | Sep 2, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/166
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Electronics assemblies and methods of manufacturing electronics assemblies having improved thermal performance. One example of these electronics assemblies includes a printed circuit board (PCB), an integrated circuit package mounted to the PCB, the integrated circuit packing having a heat generating component, and a heat spreader soldered to the PCB such that the heat spreader is thermally coupled to the heat generating component of the integrated circuit package to dissipate heat generated by the heat generating component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.