Light emitting diode module
US11710813B2 · kind B2 · utility
2Cited by
5References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 30, 2020 |
| Grant date | Jul 25, 2023 |
| Priority date | — |
| Expiry date | Feb 13, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L25/167
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A light emitting diode (LED) module includes an integrated substrate, the integrated substrate including a plurality of LEDs; a glass substrate; and a signal wiring layer provided on the glass substrate. The signal wiring layer includes a plurality of signal electrodes configured to supply a data signal to the plurality of LEDs. The LED module further includes a conductive pattern provided on at least one surface of the integrated substrate, and connected to a ground.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.