Lens module mounting on rigid-flex printed circuit board
US11711891B2 · kind B2 · utility
1Cited by
1References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 16, 2021 |
| Grant date | Jul 25, 2023 |
| Priority date | — |
| Expiry date | Aug 27, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10151
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A lens module mounted on rigid-flex printed circuit board (PCB) includes a rigid-flex PCB unit having two rigid PCBs and a flex PCB connected to between the two rigid PCBs, and an image sensor and a lens mounted on the flex PCB. A clearance is formed between the lens and the two rigid PCBs, and is filled with clearance glue. The clearance glue reinforces joints of the flex PCB and the two rigid PCBs, and the lens module becomes an integral structure after the clearance glue is cured.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.